名:

杨炯

      称:

教授      博士生导师  集成计算与材料设计中心 主任

出生年月:

198110

办公地点:

宝山校区东区7号楼529B

电子邮箱:

jiongy@t.shu.edu.cn


个人简况

2004     华东师范大学 化学系 学士

2009     中国科学院上海硅酸盐研究所 博士

2009     中国科学院上海硅酸盐研究所 助理研究员

2012     美国华盛顿大学 材料科学与工程系 博士后

2015     上海大学材料基因组工程研究院 教授

研究方向

1.    高性能热电材料设计

2.    材料数据库智能建立

3.    机器学习势函数及其在热电材料中的应用

4.    热电材料的多尺度计算

代表性成果

本人主要从事以电热输运理论以及多尺度计算为基础的理论工作,利用多学科优势(物理、化学、材料、信息科学)理解千变万化的材料世界。具体研究内容涉及高性能热电材料设计,材料数据库智能建立,机器学习势函数及其在热电材料中的应用,热电材料的多尺度计算等。截止20252月,在Nat.     Phys., J. Am. Chem. Soc., Energy. Environ. Sci., Adv. Mater., NPJ Comp.     Mater., Nat. Commun.SCI刊物上发表论文200余篇。总引用数10000余次,H因子55,并发表国际热电专著一章。在APSPACRIMTMSICT等国际会议上做邀请报告9次。


完整文章列表请见:https://www.webofscience.com/wos/author/record/K-6330-2014


5年来代表性工作:

v      Zhiyuan Lang, Ying Jiang*, and Jiong Yang*, et al., Microstructures,     5, 2025004, 2025

v      Yihang Zhao, Jinyang Xi*, Jiong Yang*, et al.,Computational     Materials Today, 5, 100019, 2025

v      Qiyong Chen, Jiong Yang*, and Lili Xi*, et al., Journal of     Materiomics, 11, 100832, 2025

v      Yasong Wu, Di Qiu*, Jinyang Xi*, and Jiong Yang*, et al., Journal of     Materials Science & Technology, 204, 245, 2025

v      Yuyan Yang, Shengnan Dai*, and Jiong Yang*, et al., Digital     Discovery, 3, 2201, 2024

v      Qiyong Chen, Jiong Yang*, Lili Xi*, et al., Materials Today Physics,     46, 101531, 2024

v      Yuzheng He, Jinbo Wu*, and Jiong Yang*, et al., Journal of Materials     Informatics, 4, 18, 2024

v      Jiangtao Wu, Tianran Wei*, Jiong Yang*, and Jie Ma*, et al., Nature     Communications, 15, 6248, 2024

v      Sen Xie, Jiong Yang*, Wei Liu*, and Xinfeng Tang*, et al.,     Advanced Materials, 36, 2400845, 2024

v      Shengnan Dai, Jinyang Xi*, Jiong Yang*, et al., Computational     Materials Science, 244, 113190, 2024

v      Lu Liu, Wenqing Zhang*, and Jiong Yang*, et al., MGE Advances,     2, e21, 2024

v      Qinghang Tang, Huijun Liu*, and Jiong Yang*, et al., Energy &     Environmental Science, 17, 611, 2024

v      Shen Han#, Shengnan Dai#, Jie Ma#, Jiong     Yang*, Chenguang Fu*, and Tiejun Zhu*, et al., Nature Physics 19,     1649, 2023

v      Yeqing Jin, Jiong Yang*, and Lili Xi*, et al., NPJ Comput. Mater. 9,     190, 2023

v      Yifan Zhu, Jiong Yang*, and Wenqing Zhang*, et al., Physical Review     B 108, 014108, 2023

v      Mingjia Yao, Jinyang Xi*, Jiong Yang*, and Wenqing Zhang*, et     al.,Science China Materials 66, 2768, 2023

v      Shengnan  Dai, Jinyan Ning*, Jinyang Xi*, Jiong Yang*, et al.,     Materials Today Physics, 31, 100993, 2023

v      Jialin Ji, Jiong Yang*, and Wenqing Zhang*, Journal of the American     Chemical Society, 144, 18552-18561, 2022

v      Huifang Luo, Xin Li*, Jiong Yang*, et al., NPJ Computational     Materials, 8, 199, 2022

v      Yan Cao, Lili Xi*, Jiong Yang*, et al., Journal of Materials     Chemistry A, 10, 1039-11045, 2022

v      Yifei Xiong, Pengfei Qiu*, Jiong Yang*, Xun Shi*, et al, Journal of     the American Chemical Society, 144, 8030-8037, 2022

v      Zhou Zhang, Jiong Yang*, et al., Materials Today Physics, 25,     100702, 2022

v      Hongliang Yang, Jiong Yang*, Wenqing Zhang*, et al., Physical Review B,     104, 094310, 2021

v      Ye Sheng, Jinyang Xi*, Yuexing Han*, Jiong Yang*, et al.,     Chemistry of Materials, 33, 6918-6924, 2021

v      Mingjia Yao, Jiong Yang*, et al., Scientific Data, 8, 236, 2021

v      Ziyu Wang, Jinyang Xi*, Jiong Yang*, Wenqing Zhang*, et al.,     Chemistry of Materials, 33, 1046-1052, 2021

v      Jincheng Ding, Jinyang Xi*, Jiong Yang*, et al., Journal of Materiomics, 7,     310-319, 2021

v      Xin Li, Jiong Yang*, et al., Computational Materials Science,     186, 110074, 2021

v      Yifan Zhu, Jiong Yang*, Chenguang Fu*, Wenqing Zhang*, et al., Research,     2020, 4589786, 2020

v      Ye Sheng, Jiong Yang*, Wenqing Zhang*, et al., NPJ Computational Materials,     6, 171, 2020

v      Yiming Zhang, Ziyu Wang, Jinyang Xi*, Jiong Yang*, Journal of Physics: Condensed     Matter, 32, 475503, 2020

v      Xin Li, Jiong Yang*, Wenqing Zhang*, et al., NPJ Computational     Materials, 6, 107, 2020

v      Qingyong Ren, Chenguang Fu*, Jiong Yang*, Jie Ma*, et al., Nat. Commun. , 11,     3142, 2020


软件:

TransOpt,基于VASP电子结构计算与跃迁矩阵元方法处理电输运,有效避免”能带交叉”问题。同时在电子驰豫时间上考虑了常数电声耦合近似、形变势方法以及电离杂质散射等方法。https://github.com/yangjio4849/TransOpt.git


MatHub第一性原理计算数据库:
   
三维体系 www.mathub3d.net
   
二维体系 www.mathub2d.net


 

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